Disciplines
Heat Transfer, Combustion | Polymer and Organic Materials
Abstract (300 words maximum)
In this research, we conducted a detailed experimental
investigation into how strain affects the thermal conductivity of
Ecoflex elastomer, utilizing a newly developed method for
measuring thermal conductivity under mechanical strain for the
first time. In situ thermal conductivity measurement apparatus
was developed by combining the KLA T150 nanoscale tensile tester
and a custom-fabricated thermal measurement sensor. The
development of an experimental method for measuring the thermal
conductivity of nanomaterials under mechanical testing
simultaneously will contribute to the development of novel
materials for flexible electronics by helping us to better
understand the strain effect on their thermal performance.
Interestingly, the thermal conductivity of Ecoflex elastomer is
shown to increase with an increase in tensile strain until the
engineering strain reaches 20%. This is understood to be due to
the straightened polymer chains, which makes the phonon
transport to be more efficient through the stiffened polymer
chains. At very high degrees of mechanical strain, the thermal
conductivity may decrease due to the disruption of filler-to-filler
connections and increased phonon-boundary scattering between
polymer chains and magnetic powders. This is caused by the
reduced spacing resulting from the increased mechanical strain.
The findings from this study are expected to propel the
advancement of future flexible electronics by facilitating the
creation of a foundational elastomer.
Academic department under which the project should be listed
SPCEET - Mechanical Engineering
Primary Investigator (PI) Name
Justin Park
In-situ thermal measurement of Polymers
In this research, we conducted a detailed experimental
investigation into how strain affects the thermal conductivity of
Ecoflex elastomer, utilizing a newly developed method for
measuring thermal conductivity under mechanical strain for the
first time. In situ thermal conductivity measurement apparatus
was developed by combining the KLA T150 nanoscale tensile tester
and a custom-fabricated thermal measurement sensor. The
development of an experimental method for measuring the thermal
conductivity of nanomaterials under mechanical testing
simultaneously will contribute to the development of novel
materials for flexible electronics by helping us to better
understand the strain effect on their thermal performance.
Interestingly, the thermal conductivity of Ecoflex elastomer is
shown to increase with an increase in tensile strain until the
engineering strain reaches 20%. This is understood to be due to
the straightened polymer chains, which makes the phonon
transport to be more efficient through the stiffened polymer
chains. At very high degrees of mechanical strain, the thermal
conductivity may decrease due to the disruption of filler-to-filler
connections and increased phonon-boundary scattering between
polymer chains and magnetic powders. This is caused by the
reduced spacing resulting from the increased mechanical strain.
The findings from this study are expected to propel the
advancement of future flexible electronics by facilitating the
creation of a foundational elastomer.
