In Situ Thermal Conductivity Measurement during Micro/nanoscale Tensile Test
Abstract (300 words maximum)
With the rise in technology advancement in consumer electronics, the average trend of the industry is to decrease the size of these electronics for increased use cases and efficiency. Therefore comprehensive studies must be performed on the fundamental components of microelectronics to determine the effective potential of these devices. For this study the thermal conductivity of micro-scale materials is being measured under strain for the use case of wearable microelectronics that require high heat dissipation characteristics. To investigate the thermal properties of microscale samples during mechanical strain at the same time, we developed an in situ thermal measurement method by combining infrared thermal imaging camera and KLA T150 nanoscale tensile tester. The sample heating is accomplished by taking a sample with a custom designed electronic heating system to impose heat flux in the sample. The sample is then preheated to 100 degrees Celsius to which is allowed time to equilibrate. Once the sample reaches equilibrium a thermal image is taken on a infrared camera, from there the tensile tester induces 10% strain and another thermal image is taken. This process is repeated along different strain percentages, and from these images the dimensions of the sample and thermal conductivity can be measured. The thermal conductivity values are acquired by curve-fitting the temperature distribution obtained to a cooling fin formula. For the successful demonstration of the development apparatus, we tested polymer-based materials. Further experimentation is required to establish a consistent trend.
Academic department under which the project should be listed
SPCEET - Mechanical Engineering
Primary Investigator (PI) Name
Jungkyu Park
In Situ Thermal Conductivity Measurement during Micro/nanoscale Tensile Test
With the rise in technology advancement in consumer electronics, the average trend of the industry is to decrease the size of these electronics for increased use cases and efficiency. Therefore comprehensive studies must be performed on the fundamental components of microelectronics to determine the effective potential of these devices. For this study the thermal conductivity of micro-scale materials is being measured under strain for the use case of wearable microelectronics that require high heat dissipation characteristics. To investigate the thermal properties of microscale samples during mechanical strain at the same time, we developed an in situ thermal measurement method by combining infrared thermal imaging camera and KLA T150 nanoscale tensile tester. The sample heating is accomplished by taking a sample with a custom designed electronic heating system to impose heat flux in the sample. The sample is then preheated to 100 degrees Celsius to which is allowed time to equilibrate. Once the sample reaches equilibrium a thermal image is taken on a infrared camera, from there the tensile tester induces 10% strain and another thermal image is taken. This process is repeated along different strain percentages, and from these images the dimensions of the sample and thermal conductivity can be measured. The thermal conductivity values are acquired by curve-fitting the temperature distribution obtained to a cooling fin formula. For the successful demonstration of the development apparatus, we tested polymer-based materials. Further experimentation is required to establish a consistent trend.