An Adaptive Element-Level Impedance-Matched ASIC With Improved Acoustic Reflectivity for Medical Ultrasound Imaging

Ahmad Rezvanitabar, School of Electrical and Computer Engineering
M. Sait Kilinc, School of Electrical and Computer Engineering
Coskun Tekes, Kennesaw State University
Evren F. Arkan, Georgia Institute of Technology


This paper presents an active impedance matching scheme that tries to optimize electrical power transfer and acoustic reflectivity in ultrasound transducers. Leveraging negative capacitance-based impedance matching would potentially improve the bandwidth and electrical power transfer while minimizing acoustic reflection of transducer elements and improve uniformity while reducing acoustic crosstalk of transducer arrays. A 16-element transceiver front-end is designed which employs an element-level active capacitive impedance cancellation scheme using an element-level negative impedance converter. The ASIC fabricated in 180-nm HVBCD technology provides high-voltage pulses up to 60 V consuming 3.6 mW and occupying 2.5 mm2. The front-end ASIC is used with a 1-D capacitive micromachined ultrasonic transducer (CMUT) array and its acoustical reflectivity reduction and imaging capabilities have successfully been demonstrated through pulse-echo measurements and acoustic imaging experiments.