Optimisation of Process Parameters and Residual Stress Analysis of Transmission Laser Microjoining of Glass and Silicon
A three-dimensional transient simulation for thermal and thermal stress analysis of transmission laser microjoining of dissimilar materials is performed. The laser beam moving at a velocity passes through the transparent glass (Gl), gets absorbed by the absorbing silicon (Si), and eventually softens/melts the Gl to form the bond. A good comparison is observed between the computational and experimental bond widths. Through computational optimisation of process parameters, it is observed that at a laser velocity of 30 mm/min with an initial dwell time of about four seconds good bonding was obtained with increasing bond widths. Acceleration is added which results in a uniform bond width. Subsequently, room temperature residual stress profiles of the microjoint are calculated. Stress profiles on both the Gl and Si surfaces show similar trend. At room temperature both the surfaces show low stresses which do not cross the tensile or the compressive strengths of the respective materials.
International Journal of Materials and Product Technology
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